The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces

K. S. Kim, K. W. Ryu, C. H. Yu, J. M. Kim. The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces. Microelectronics Reliability, 45(3-4):647-655, 2005. [doi]

Abstract

Abstract is missing.