Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan. Invited - Cross-layer modeling and optimization for electromigration induced reliability. In Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016. pages 30, ACM, 2016. [doi]
@inproceedings{KimSCZLWT16,
title = {Invited - Cross-layer modeling and optimization for electromigration induced reliability},
author = {Taeyoung Kim and Zeyu Sun and Chase Cook and Hengyang Zhao and Ruiwen Li and Daniel Wong and Sheldon X.-D. Tan},
year = {2016},
doi = {10.1145/2897937.2905010},
url = {http://doi.acm.org/10.1145/2897937.2905010},
researchr = {https://researchr.org/publication/KimSCZLWT16},
cites = {0},
citedby = {0},
pages = {30},
booktitle = {Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016},
publisher = {ACM},
isbn = {978-1-4503-4236-0},
}