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Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing

Tae-Kyun Kim, Jong Gwan Yook, Joo-Yong Kim, Yong-Ho Cho, Uh-Hyeon Lee. Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing. Sensors, 23(14):6350, July 2023. [doi]

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