K. S. Kim, C. H. Yu, N. H. Kim, N. K. Kim, H.-J. Chang, E. G. Chang. Isothermal aging characteristics of Sn-Pb micro solder bumps. Microelectronics Reliability, 43(5):757-763, 2003. [doi]
@article{KimYKKCC03,
title = {Isothermal aging characteristics of Sn-Pb micro solder bumps},
author = {K. S. Kim and C. H. Yu and N. H. Kim and N. K. Kim and H.-J. Chang and E. G. Chang},
year = {2003},
doi = {10.1016/S0026-2714(03)00060-X},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00060-X},
tags = {C++},
researchr = {https://researchr.org/publication/KimYKKCC03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {5},
pages = {757-763},
}