Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo. A 137-mW, 4 ch × 25-Gbps Low-Power Compact Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si. In Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, CA, USA, March 11-15, 2018. pages 1-3, IEEE, 2018. [doi]
@inproceedings{KishiNKNKFNKHSK18,
title = {A 137-mW, 4 ch × 25-Gbps Low-Power Compact Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si},
author = {Toshiki Kishi and Munehiko Nagatani and Shigeru Kanazawa and Shinsuke Nakano and Hiroaki Katsurai and Takuro Fujii and Hidetaka Nishi and Takaaki Kakitsuka and Koichi Hasebe and Kota Shikama and Yuko Kawajiri and Atsushi Aratake and Hideyuki Nosaka and Hiroshi Fukuda and Shinji Matsuo},
year = {2018},
url = {http://ieeexplore.ieee.org/document/8385725},
researchr = {https://researchr.org/publication/KishiNKNKFNKHSK18},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, CA, USA, March 11-15, 2018},
publisher = {IEEE},
isbn = {978-1-943580-38-5},
}