Defective Wafer Detection Using Sensed Numerical Features

Kotcharat Kitchat, Ching-Yu Lin, Min-Te Sun. Defective Wafer Detection Using Sensed Numerical Features. In 2021 IEEE International Conference on Omni-Layer Intelligent Systems, COINS 2021, Barcelona, Spain, August 23-25, 2021. pages 1-6, IEEE, 2021. [doi]

@inproceedings{KitchatLS21,
  title = {Defective Wafer Detection Using Sensed Numerical Features},
  author = {Kotcharat Kitchat and Ching-Yu Lin and Min-Te Sun},
  year = {2021},
  doi = {10.1109/COINS51742.2021.9524156},
  url = {https://doi.org/10.1109/COINS51742.2021.9524156},
  researchr = {https://researchr.org/publication/KitchatLS21},
  cites = {0},
  citedby = {0},
  pages = {1-6},
  booktitle = {2021 IEEE International Conference on Omni-Layer Intelligent Systems, COINS 2021, Barcelona, Spain, August 23-25, 2021},
  publisher = {IEEE},
  isbn = {978-1-6654-3156-9},
}