Assembling 2D blocks into 3D chips

Johann Knechtel, Igor L. Markov, Jens Lienig. Assembling 2D blocks into 3D chips. In Yao-Wen Chang, Jiang Hu, editors, Proceedings of the 2011 International Symposium on Physical Design, ISPD 2011, Santa Barbara, California, USA, March 27-30, 2011. pages 81-88, ACM, 2011. [doi]

@inproceedings{KnechtelML11,
  title = {Assembling 2D blocks into 3D chips},
  author = {Johann Knechtel and Igor L. Markov and Jens Lienig},
  year = {2011},
  doi = {10.1145/1960397.1960417},
  url = {http://doi.acm.org/10.1145/1960397.1960417},
  tags = {Markov},
  researchr = {https://researchr.org/publication/KnechtelML11},
  cites = {0},
  citedby = {0},
  pages = {81-88},
  booktitle = {Proceedings of the 2011 International Symposium on Physical Design, ISPD 2011, Santa Barbara, California, USA, March 27-30, 2011},
  editor = {Yao-Wen Chang and Jiang Hu},
  publisher = {ACM},
  isbn = {978-1-4503-0550-1},
}