Thermal Condition Monitoring System Fully Printed on a 3D Substrate

Marcel Knoll, Christina Offenzeller, Bernhard Mayrhofer, Bernhard Jakoby, Wolfgang Hilber. Thermal Condition Monitoring System Fully Printed on a 3D Substrate. In 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019. pages 1-4, IEEE, 2019. [doi]

Abstract

Abstract is missing.