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Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies

Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, P. S. Chen, J.-H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen. Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]

Authors

Cheng-Ta Ko

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Zhi-Cheng Hsiao

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Y. J. Chang

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P. S. Chen

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J.-H. Huang

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Hsin-Chia Fu

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Y. J. Huang

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C. W. Chiang

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W. L. Tsat

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Y. H. Chen

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Wei-Chung Lo

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Kuan-Neng Chen

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