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Wafer-level 3D integration technology

Steven J. Koester, Albert M. Young, Roy R. Yu, Sampath Purushothaman, Kuan-Neng Chen, Douglas C. La Tulipe Jr., Narender Rana, Leathen Shi, Matthew R. Wordeman, Edmund J. Sprogis. Wafer-level 3D integration technology. IBM Journal of Research and Development, 52(6):583-597, 2008. [doi]

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