Masahiro Kondo, Hidetoshi Miyashita, Sang-Seok Lee, Nobuo Matsuoka. Tentative bonding effect for maintaining alignment accuracy in bonding utilizing thick SU8 as an adhesive material. In 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015, Xi'an, China, April 7-11, 2015. pages 487-490, IEEE, 2015. [doi]
Abstract is missing.