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Analysis of electrostatic coupling in monolithic 3D integrated circuits and its impact on delay testing

Abhishek Koneru, Krishnendu Chakrabarty. Analysis of electrostatic coupling in monolithic 3D integrated circuits and its impact on delay testing. In 21th IEEE European Test Symposium, ETS 2016, Amsterdam, Netherlands, May 23-27, 2016. pages 1-6, IEEE, 2016. [doi]

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