Lay Wai Kong, Osborne A. Martin. Known void size micro-bump, a novel standard of 3D X-ray computed tomography in-line metrology for accuracy assessment and monitoring. In IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2018, Houston, TX, USA, May 14-17, 2018. pages 1-5, IEEE, 2018. [doi]
Abstract is missing.