A practical yield prediction approach using inline defect metrology data for system-on-chip integrated circuits

Yuting Kong, Dong Ni. A practical yield prediction approach using inline defect metrology data for system-on-chip integrated circuits. In 13th IEEE Conference on Automation Science and Engineering, CASE 2017, Xi'an, China, August 20-23, 2017. pages 744-749, IEEE, 2017. [doi]

@inproceedings{KongN17,
  title = {A practical yield prediction approach using inline defect metrology data for system-on-chip integrated circuits},
  author = {Yuting Kong and Dong Ni},
  year = {2017},
  doi = {10.1109/COASE.2017.8256193},
  url = {https://doi.org/10.1109/COASE.2017.8256193},
  researchr = {https://researchr.org/publication/KongN17},
  cites = {0},
  citedby = {0},
  pages = {744-749},
  booktitle = {13th IEEE Conference on Automation Science and Engineering, CASE 2017, Xi'an, China, August 20-23, 2017},
  publisher = {IEEE},
  isbn = {978-1-5090-6781-7},
}