Youngsun Kong, Hugo F. Posada-Quintero, Ki H. Chon. Multi-level Pain Quantification using a Smartphone and Electrodermal Activity. In 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society, EMBC 2022, Glasgow, Scotland, United Kingdom, July 11-15, 2022. pages 2475-2478, IEEE, 2022. [doi]
Abstract is missing.