Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling

Michal Kopec, Boguslaw Wiecek. Thermal Characterization of Electronic Components Using Single-detector IR Measurement and 3D Heat Transfer Modelling. In Andrzej Napieralksi, editor, 27th International Conference on Mixed Design of Integrated Circuits and System, MIXDES 2020, Wroclaw, Poland, June 25-27, 2020. pages 139-143, IEEE, 2020. [doi]

Abstract

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