Daisuke Kosaka, Yoji Bando, Goichi Yokomizo, Kunihiko Tsuboi, Ying Shiun Li, Shen Lin, Makoto Nagata. A full chip integrated power and substrate noise analysis framework for mixed-signal SoC design. In IEEE Custom Integrated Circuits Conference, CICC 2009, San Jose, California, USA, 13-16 September, 2009, Proceedings. pages 219-222, IEEE, 2009. [doi]
@inproceedings{KosakaBYTLLN09,
title = {A full chip integrated power and substrate noise analysis framework for mixed-signal SoC design},
author = {Daisuke Kosaka and Yoji Bando and Goichi Yokomizo and Kunihiko Tsuboi and Ying Shiun Li and Shen Lin and Makoto Nagata},
year = {2009},
doi = {10.1109/CICC.2009.5280883},
url = {http://dx.doi.org/10.1109/CICC.2009.5280883},
researchr = {https://researchr.org/publication/KosakaBYTLLN09},
cites = {0},
citedby = {0},
pages = {219-222},
booktitle = {IEEE Custom Integrated Circuits Conference, CICC 2009, San Jose, California, USA, 13-16 September, 2009, Proceedings},
publisher = {IEEE},
isbn = {978-1-4244-4071-9},
}