Atsutake Kosuge, Shu Ishizuka, Junichiro Kadamoto, Tadahiro Kuroda. 10.1 A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver. In 2015 IEEE International Solid-State Circuits Conference, ISSCC 2015, Digest of Technical Papers, San Francisco, CA, USA, February 22-26, 2015. pages 1-3, IEEE, 2015. [doi]
@inproceedings{KosugeIKK15, title = {10.1 A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver}, author = {Atsutake Kosuge and Shu Ishizuka and Junichiro Kadamoto and Tadahiro Kuroda}, year = {2015}, doi = {10.1109/ISSCC.2015.7062983}, url = {http://dx.doi.org/10.1109/ISSCC.2015.7062983}, researchr = {https://researchr.org/publication/KosugeIKK15}, cites = {0}, citedby = {0}, pages = {1-3}, booktitle = {2015 IEEE International Solid-State Circuits Conference, ISSCC 2015, Digest of Technical Papers, San Francisco, CA, USA, February 22-26, 2015}, publisher = {IEEE}, isbn = {978-1-4799-6224-2}, }