Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka. Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding. In Jacqueline Snyder, Rakesh Patel, Tom Andre, editors, IEEE Custom Integrated Circuits Conference, CICC 2010, San Jose, California, USA, 19-22 September, 2010, Proceedings. pages 1-4, IEEE, 2010. [doi]
@inproceedings{KoyanagiFT10,
title = {Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding},
author = {Mitsumasa Koyanagi and Takafumi Fukushima and Tetsu Tanaka},
year = {2010},
doi = {10.1109/CICC.2010.5617626},
url = {http://dx.doi.org/10.1109/CICC.2010.5617626},
researchr = {https://researchr.org/publication/KoyanagiFT10},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE Custom Integrated Circuits Conference, CICC 2010, San Jose, California, USA, 19-22 September, 2010, Proceedings},
editor = {Jacqueline Snyder and Rakesh Patel and Tom Andre},
publisher = {IEEE},
isbn = {978-1-4244-5758-8},
}