Sriharini Krishnakumar, Inna Partin-Vaisband. Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution. In Jürgen Becker 0001, Andrew Marshall, Tanja Harbaum, Amlan Ganguly, Fahad Siddiqui, Kieran McLaughlin, editors, 36th IEEE International System-on-Chip Conference, SOCC 2023, Santa Clara, CA, USA, September 5-8, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{KrishnakumarP23, title = {Vertical Power Delivery for Emerging Packaging and Integration Platforms - Power Conversion and Distribution}, author = {Sriharini Krishnakumar and Inna Partin-Vaisband}, year = {2023}, doi = {10.1109/SOCC58585.2023.10256973}, url = {https://doi.org/10.1109/SOCC58585.2023.10256973}, researchr = {https://researchr.org/publication/KrishnakumarP23}, cites = {0}, citedby = {0}, pages = {1-6}, booktitle = {36th IEEE International System-on-Chip Conference, SOCC 2023, Santa Clara, CA, USA, September 5-8, 2023}, editor = {Jürgen Becker 0001 and Andrew Marshall and Tanja Harbaum and Amlan Ganguly and Fahad Siddiqui and Kieran McLaughlin}, publisher = {IEEE}, isbn = {979-8-3503-0011-6}, }