Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling

Patrick Krüger, Thomas Voß, Matthias Wietstruck. Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]

@inproceedings{KrugerVW21,
  title = {Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling},
  author = {Patrick Krüger and Thomas Voß and Matthias Wietstruck},
  year = {2021},
  doi = {10.1109/3DIC52383.2021.9687600},
  url = {https://doi.org/10.1109/3DIC52383.2021.9687600},
  researchr = {https://researchr.org/publication/KrugerVW21},
  cites = {0},
  citedby = {0},
  pages = {1-5},
  booktitle = {IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021},
  publisher = {IEEE},
  isbn = {978-1-6654-1706-8},
}