Abstract is missing.
- Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System PerformanceAnkit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir. 1-5 [doi]
- Multi-ANN embedded system based on a custom 3D-DRAMLee Baker, Robert Patti, Paul D. Franzon. 1-7 [doi]
- Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulationsAyano Furue, Satoshi Matsumoto. 1-5 [doi]
- Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer TestingTakafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan. 1-4 [doi]
- Proposed Standardization of Heterogenous Integrated Chiplet ModelsAnthony Mastroianni, Benjamin Kerr, Jawad Nasrullah, Kevin Cameron, Hockshan James Wong, David Ratchkov, Joseph A. Reynick. 1-8 [doi]
- Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient ConditionsLiangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan. 1-5 [doi]
- Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICsSreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir. 1-5 [doi]
- A Virtual Platform for Object Detection SystemsQianli Zhao, W. Rhett Davis. 1-6 [doi]
- 3D interconnection using copper direct hybrid bonding for GaN on silicon waferC. Dubarry, L. Arnaud, M. L. Calvo Munoz, Gaëlle Mauguen, S. Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier. 1-4 [doi]
- Design for 3-D Stacked Neural Network Circuit with Cyclic Analog ComputingKoji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi. 1-4 [doi]
- Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI ApplicationsMariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima. 1-4 [doi]
- A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-ViaZiyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen. 1-4 [doi]
- Implementation of a Chaotic Neural Network Reservoir on a TSV/$\mu\text{Bump}$ Stacked 3D Cyclic Neural Network Integrated CircuitYoshihiko Horio, Takemori Orima, Koji Kiyoyama, Mitsumasa Koyanagi. 1-4 [doi]
- Numerical predictions of 3D power-supply on chip taking into considerations of proximity effectShinei Miyasaka, Satoshi Matumoto. 1-4 [doi]
- Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through ThermocyclingPatrick Krüger, Thomas Voß, Matthias Wietstruck. 1-5 [doi]
- A Review of 3D-Dynamic Random-Access Memory based Near-Memory ComputationPrasanth Prabu Ravichandiran, Paul D. Franzon. 1-6 [doi]
- Fully integrated transformer less floating gate driver for 3D power supply on chipYuske Ogushi, Satoshi Matsumoto. 1-6 [doi]