Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan. Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]
Abstract is missing.