Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions - researchr publication authors

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Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan. Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]

This author has not been identified. Look up 'Liangxing Hu' in GoogleThis author has not been identified. Look up 'Simon Chun Kiat Goh' in GoogleThis author has not been identified. Look up 'Yu Dian Lim' in GoogleThis author has not been identified. Look up 'Peng Zhao' in GoogleThis author has not been identified. Look up 'Michael Joo Zhong Lim' in GoogleThis author has not been identified. Look up 'Chuan Seng Tan' in Google

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