Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan. Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]
@inproceedings{HuGLZLT21,
title = {Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions},
author = {Liangxing Hu and Simon Chun Kiat Goh and Yu Dian Lim and Peng Zhao and Michael Joo Zhong Lim and Chuan Seng Tan},
year = {2021},
doi = {10.1109/3DIC52383.2021.9687609},
url = {https://doi.org/10.1109/3DIC52383.2021.9687609},
researchr = {https://researchr.org/publication/HuGLZLT21},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021},
publisher = {IEEE},
isbn = {978-1-6654-1706-8},
}