A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via

Ziyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen. A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]

Abstract

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