Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Massimo Bertoletti, Carmelo Maiorca, Rossana Zadra, Massimo Inzaghi, Gabriele Gattere, Giancarlo Zinco, Paolo Valente, Roberto Bardelli, Alessandro Valerio, Pierluigi Rolandi, Mattia Monetti, Valentina Cuomo, Salvatore Santapa. Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance. In Laleh Behjat, Stephen Yang, editors, ISPD 2022: International Symposium on Physical Design, Virtual Event, Canada, March 27 - 30, 2022. pages 83-89, ACM, 2022. [doi]
Abstract is missing.