Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim. Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs. In Chris Chu, Ismail Bustany, editors, Proceedings of the 2018 International Symposium on Physical Design, ISPD 2018, Monterey, CA, USA, March 25-28, 2018. pages 90-97, ACM, 2018. [doi]
Abstract is missing.