Chuen Tse Kuah, Kuan Yew Wong. A review of data envelopment analysis models for handling data variations. In 2011 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM), Singapore, Singapore, December 6-9, 2011. pages 151-155, IEEE, 2011. [doi]
@inproceedings{KuahW11-0,
title = {A review of data envelopment analysis models for handling data variations},
author = {Chuen Tse Kuah and Kuan Yew Wong},
year = {2011},
doi = {10.1109/IEEM.2011.6117897},
url = {http://dx.doi.org/10.1109/IEEM.2011.6117897},
researchr = {https://researchr.org/publication/KuahW11-0},
cites = {0},
citedby = {0},
pages = {151-155},
booktitle = {2011 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM), Singapore, Singapore, December 6-9, 2011},
publisher = {IEEE},
isbn = {978-1-4577-0740-7},
}