Micro-bump assignment for 3D ICs using order relation - researchr publication authors

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Ta-Yu Kuan, Yi-Chun Chang, Tai-Chen Chen. Micro-bump assignment for 3D ICs using order relation. In Proceedings of the 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, Australia, January 30 - February 2, 2012. pages 341-346, IEEE, 2012. [doi]

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