Ta-Yu Kuan, Yi-Chun Chang, Tai-Chen Chen. Micro-bump assignment for 3D ICs using order relation. In Proceedings of the 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, Australia, January 30 - February 2, 2012. pages 341-346, IEEE, 2012. [doi]
@inproceedings{KuanCC12,
title = {Micro-bump assignment for 3D ICs using order relation},
author = {Ta-Yu Kuan and Yi-Chun Chang and Tai-Chen Chen},
year = {2012},
doi = {10.1109/ASPDAC.2012.6164970},
url = {http://dx.doi.org/10.1109/ASPDAC.2012.6164970},
researchr = {https://researchr.org/publication/KuanCC12},
cites = {0},
citedby = {0},
pages = {341-346},
booktitle = {Proceedings of the 17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012, Sydney, Australia, January 30 - February 2, 2012},
publisher = {IEEE},
isbn = {978-1-4673-0770-3},
}