Martin Kuball, James W. Pomeroy, Filip Gucmann, Bahar Oner. Thermal analysis of semiconductor devices and materials - Why should I not trust a thermal simulation ?. In 2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS), Nashville, TN, USA, November 3-6, 2019. pages 1-5, IEEE, 2019. [doi]
@inproceedings{KuballPGO19,
title = {Thermal analysis of semiconductor devices and materials - Why should I not trust a thermal simulation ?},
author = {Martin Kuball and James W. Pomeroy and Filip Gucmann and Bahar Oner},
year = {2019},
doi = {10.1109/BCICTS45179.2019.8972763},
url = {https://doi.org/10.1109/BCICTS45179.2019.8972763},
researchr = {https://researchr.org/publication/KuballPGO19},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS), Nashville, TN, USA, November 3-6, 2019},
publisher = {IEEE},
isbn = {978-1-7281-0586-4},
}