Johannes Maximilian Kühn, Hideharu Amano, Oliver Bringmann, Wolfgang Rosenstiel. Fined-grained body biasing for frequency scaling in advanced SOI processes. In 2015 IEEE Symposium in Low-Power and High-Speed Chips, COOL CHIPS XVIII, Yokohama, Japan, April 13-15, 2015. pages 1-3, IEEE, 2015. [doi]
Abstract is missing.