A Model for T-Way Fault Profile Evolution during Testing

D. Richard Kuhn, Raghu N. Kacker, Yu Lei. A Model for T-Way Fault Profile Evolution during Testing. In 2017 IEEE International Conference on Software Testing, Verification and Validation Workshops, ICST Workshops 2017, Tokyo, Japan, March 13-17, 2017. pages 162-170, IEEE Computer Society, 2017. [doi]

@inproceedings{KuhnKL17,
  title = {A Model for T-Way Fault Profile Evolution during Testing},
  author = {D. Richard Kuhn and Raghu N. Kacker and Yu Lei},
  year = {2017},
  doi = {10.1109/ICSTW.2017.35},
  url = {http://dx.doi.org/10.1109/ICSTW.2017.35},
  researchr = {https://researchr.org/publication/KuhnKL17},
  cites = {0},
  citedby = {0},
  pages = {162-170},
  booktitle = {2017 IEEE International Conference on Software Testing, Verification and Validation Workshops, ICST Workshops 2017, Tokyo, Japan, March 13-17, 2017},
  publisher = {IEEE Computer Society},
  isbn = {978-1-5090-6676-6},
}