Chieh Kung, Hsu-Chiang Kuan, Chen-Feng Kuan. Evaluation of tensile strength of 3D printed objects with FDM process on RepRap platform. In 1st IEEE International Conference on Knowledge Innovation and Invention, ICKII 2018, Jeju Island, Korea (South), July 23-27, 2018. pages 369-372, IEEE, 2018. [doi]
Abstract is missing.