Chun-Yi Kuo, Chi-Jih Shih, Yi-Chang Lu, James Chien-Mo Li, Krishnendu Chakrabarty. Testing of TSV-Induced Small Delay Faults for 3-D Integrated Circuits. IEEE Trans. VLSI Syst., 22(3):667-674, 2014. [doi]
@article{KuoSLLC14,
title = {Testing of TSV-Induced Small Delay Faults for 3-D Integrated Circuits},
author = {Chun-Yi Kuo and Chi-Jih Shih and Yi-Chang Lu and James Chien-Mo Li and Krishnendu Chakrabarty},
year = {2014},
doi = {10.1109/TVLSI.2013.2250320},
url = {http://dx.doi.org/10.1109/TVLSI.2013.2250320},
researchr = {https://researchr.org/publication/KuoSLLC14},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {22},
number = {3},
pages = {667-674},
}