Methods for TSVs placement in 3D Network-on-Chip

Lev Kurbanov, Nadezhda Matveeva, Elena Suvorova. Methods for TSVs placement in 3D Network-on-Chip. In 19th Conference of Open Innovations Association, FRUCT 2016, Jyväskylä, Finland, November 7-11, 2016. pages 113-120, IEEE, 2016. [doi]

Abstract

Abstract is missing.