Ding-Ming Kwai. Homogeneous integration for 3D IC with TSV. In Proceedings of the 15th Asia South Pacific Design Automation Conference, ASP-DAC 2010, Taipei, Taiwan, January 18-21, 2010. pages 546-547, IEEE, 2010.
@inproceedings{Kwai10,
title = {Homogeneous integration for 3D IC with TSV},
author = {Ding-Ming Kwai},
year = {2010},
researchr = {https://researchr.org/publication/Kwai10},
cites = {0},
citedby = {0},
pages = {546-547},
booktitle = {Proceedings of the 15th Asia South Pacific Design Automation Conference, ASP-DAC 2010, Taipei, Taiwan, January 18-21, 2010},
publisher = {IEEE},
isbn = {978-1-60558-837-7},
}