Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik. Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectronics Reliability, 46(2-4):589-599, 2006. [doi]
@article{KwonHP06,
title = {Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study},
author = {Woon-Seong Kwon and Suk-Jin Ham and Kyung-Wook Paik},
year = {2006},
doi = {10.1016/j.microrel.2005.06.014},
url = {http://dx.doi.org/10.1016/j.microrel.2005.06.014},
researchr = {https://researchr.org/publication/KwonHP06},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {46},
number = {2-4},
pages = {589-599},
}