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Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik. Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectronics Reliability, 46(2-4):589-599, 2006. [doi]

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