Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Goran Stemme, Thorbjorn Ebefors, Frank Niklaus. Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires. IEEE Access, 6:44306-44317, 2018. [doi]
@article{LaaksoBLMAFSEN18,
title = {Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires},
author = {Miku J. Laakso and Simon J. Bleiker and Jessica Liljeholm and Gustaf E. Martensson and Mikhail Asiatici and Andreas C. Fischer and Goran Stemme and Thorbjorn Ebefors and Frank Niklaus},
year = {2018},
doi = {10.1109/ACCESS.2018.2861886},
url = {https://doi.org/10.1109/ACCESS.2018.2861886},
researchr = {https://researchr.org/publication/LaaksoBLMAFSEN18},
cites = {0},
citedby = {0},
journal = {IEEE Access},
volume = {6},
pages = {44306-44317},
}