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Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Goran Stemme, Thorbjorn Ebefors, Frank Niklaus. Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires. IEEE Access, 6:44306-44317, 2018. [doi]

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