3D integration and challenges for advanced RF and microwave systems: EDA perspective - researchr publication authors

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Rosa R. Lahiji, Timothy T. Lee, Warren P. Snapp. 3D integration and challenges for advanced RF and microwave systems: EDA perspective. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-2, IEEE, 2016. [doi]

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