Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads

Yung-Hao Lai, Yang-Lang Chang, Jyh Perng Fang, Lena Chang, Hirokazu Kobayashi. Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads. IEICE Transactions, 99-A(6):1206-1215, 2016. [doi]

@article{LaiCFCK16,
  title = {Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads},
  author = {Yung-Hao Lai and Yang-Lang Chang and Jyh Perng Fang and Lena Chang and Hirokazu Kobayashi},
  year = {2016},
  url = {http://search.ieice.org/bin/summary.php?id=e99-a_6_1206},
  researchr = {https://researchr.org/publication/LaiCFCK16},
  cites = {0},
  citedby = {0},
  journal = {IEICE Transactions},
  volume = {99-A},
  number = {6},
  pages = {1206-1215},
}