Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads

Yung-Hao Lai, Yang-Lang Chang, Jyh Perng Fang, Lena Chang, Hirokazu Kobayashi. Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads. IEICE Transactions, 99-A(6):1206-1215, 2016. [doi]

Abstract

Abstract is missing.