Yi-Shao Lai, Tong Hong Wang. Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectronics Reliability, 45(3-4):575-582, 2005. [doi]
@article{LaiW05,
title = {Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly},
author = {Yi-Shao Lai and Tong Hong Wang},
year = {2005},
doi = {10.1016/j.microrel.2004.09.007},
url = {http://dx.doi.org/10.1016/j.microrel.2004.09.007},
tags = {reliability},
researchr = {https://researchr.org/publication/LaiW05},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {45},
number = {3-4},
pages = {575-582},
}