ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments - researchr publication authors

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Pradeep Lall, Shantanu Deshpande, Luu Nguyen. ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments. In IEEE International Conference on Prognostics and Health Management, ICPHM 2016, Ottawa, ON, Canada, June 20-22, 2016. pages 1-10, IEEE, 2016. [doi]

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