Pradeep Lall, Shantanu Deshpande, Luu Nguyen. ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments. In IEEE International Conference on Prognostics and Health Management, ICPHM 2016, Ottawa, ON, Canada, June 20-22, 2016. pages 1-10, IEEE, 2016. [doi]
@inproceedings{LallDN16,
title = {ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments},
author = {Pradeep Lall and Shantanu Deshpande and Luu Nguyen},
year = {2016},
doi = {10.1109/ICPHM.2016.7542851},
url = {https://doi.org/10.1109/ICPHM.2016.7542851},
researchr = {https://researchr.org/publication/LallDN16},
cites = {0},
citedby = {0},
pages = {1-10},
booktitle = {IEEE International Conference on Prognostics and Health Management, ICPHM 2016, Ottawa, ON, Canada, June 20-22, 2016},
publisher = {IEEE},
isbn = {978-1-5090-0382-2},
}