Pradeep Lall, Kalyan Dornala, Junchao Wei, Ryan Lowe, Jason Foley. Prognostication of solder-joint reliability of 0.4mm and 0.5mm pitch bgas subjected to mechanical shocks up to 10, 000G. In 2015 IEEE Conference on Prognostics and Health Management, ICPHM 2015, Austin, TX, USA, June 22-25, 2015. pages 1-14, IEEE, 2015. [doi]
Abstract is missing.