Clinton K. Landrock, Badr Omrane, Yindar Chuo, Bozena Kaminska, Jeydmer Aristizabal. 2D and 3D integration with organic and silicon electronics. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 899-904, IEEE, 2011. [doi]
@inproceedings{LandrockOCKA11,
title = {2D and 3D integration with organic and silicon electronics},
author = {Clinton K. Landrock and Badr Omrane and Yindar Chuo and Bozena Kaminska and Jeydmer Aristizabal},
year = {2011},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5763301},
researchr = {https://researchr.org/publication/LandrockOCKA11},
cites = {0},
citedby = {0},
pages = {899-904},
booktitle = {Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011},
publisher = {IEEE},
isbn = {978-1-61284-208-0},
}